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Overview  
Heat sinks quotation  
Heat exchanger quotation  
 
       
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STANDARD HEAT SINKS : HOW TO DEFINE
Heat sink type Length (extruded heatsinks) mm
Hole pattern Blank Special send sketch to F. D. I.
           
Surface finish Raw   Matt black anodised
  Alocromed   Other (refer to F. D.I.)
 
SPECIAL HEAT SINKS REQUIREMENTS
Type of Component to be cooled
Press Pack (Diode, Thyristor, GTO) Surface Mount (IGBT)
Surface area of the component case(s) to be cooled:
  One sided Two sided
 
Type of cooling system being consider
AIR Press Pack (Diode, Thyristor, GTO) Surface Mount (IGBT)
LIQUID  
Specify type of liquid:
Specify cooling device material: Copper Aluminum
  Insulated material Other
 
Thermal Characteristics  
Power per semiconductor: Watts  
Total Power to be dissipated: Watts  
       
Specify duty cycle per semiconductor Watts  
Specify total duty cycle Watts  
       
What is the dissipated power gain you wish to achieve?  
Indicates what is the temperature of the cooling device: ºC
PS. If reference to junction or case temperature,
please supply corresponding data sheet or Rth
       
Flow rate : l/s or l/mn  
Maximum pressure drop: Pa or mbar  
       
Special Application Considerations
Insulation of components Minimum or maximum operating Temperatures
Shock and vibration withstand Corrosion
Mountings Dust
Maintenance Altitude (Above 1500m)
Weight Noise level (dBA)
Minimum or maximum storage Temperatures Other constraint to be noted
 
Project Information
Number of parts (Total or Annual)
Lead Time for 1st series
Target Cost
 
(*) Compulsory field