When considering the cooling of electronic components we
can simplify the objectives as follows:
Reduce overall electronics cost,
Reduce the application's required component rating,
Increase commutated power,
Improved long term reliability.
To illustrate this, consider the following example. An electronic
surface mount component is placed on the cooling device, as
seen in the previous schematic.
If we define an equivalent heat exchange coefficient , Heq,
as follows:
to summarize, the higher the Heq the more efficient the cooling
device.
A higher Heq can bring success in reaching our objectives.
The table on the right shows a relative comparison of Ferraz
Shawmut Thermal Management solutions applying Heq values.
Also see each specific data sheet which indicates relative
Heq characteristics.
Note that:
Comparing
Thermal performance : The solutions
Classification
based on Heq
Product
Cooling
Source
Cooling
Type
Material
Applied
Technology
Application
Radiacal®
Fabfin
Air
Heat
Sink
Aluminum
(Copper)
Extruded
Aluminum
Assembly by Swaging
Cooling
of all types of
microelectronics
components
Radiacal®
Corrugated
Air
Heat Sink
Aluminum
Soldered
or bonded
Corrugated channels
Cooling
of all types of
components with press
or surface mounting
Transcal®
Air
Heat Pipe
Aluminum
(Copper)
Copper
tube with water,
Methanol, fluorocarbon
Cooling
of all types of components,
ideal for sealed enclosures.
Electrical isolation added feature
Calitube
Water
Cold Plate
Aluminum
Copper,
Staimless Steel
Stainless
steel or copper
tubing inserted into an
aluminum block
Cooling
of all types of components,
with press pack or
surface mounting
